singlecrystal inverse pole figure software

Microstructure control starts from crystal growth, which is one of the most important topics in multi-disciplinary sciences because the crystal growth controls the properties of semiconductors, metals and ceramics in thermal processing. The anisotropy tends to cause early failure of microbumps in the high-performance devices thus, precise microstructure control is required. Clearly, we can assume an isotropic microstructure in the latter, and microstructure control is not a concern however, in the former, the microstructure is anisotropic, for example, the orientation of a grain can change from one microbump to another microbump. When the diameter changes by 10 times, the volume changes by 1000 times, which indicates that if we assume that the grain size is 10 μm, the microbump will consist of one grain however, the flip chip joint will contain 1000 grains. In flip chip packaging technology, the diameter is ~100 μm, and in microbumps for 3D IC packaging, the diameter is ~10 μm. We consider the diameter of a solder joint below. Because the merging of chip technology and packaging technology is needed to extend Moore’s law, it is crucial to have precise control of manufacturing in packaging technology. In 3D ICs, there are thousands of microbumps on a through-Si-via chip, and precise control of the microstructure of all the microbumps is required, which is a new paradigm in the microelectronic industry. One example is the use of lattice strain to increase the carrier mobility in Si channels. In the trend of miniaturization of Si chip technology, the precise fabrication of hundreds of millions of transistors and their gates and contacts on a Si chip has been the foundation of Moore’s law. On a limited chip area and in a tight device space, the best way to increase the density of high-performance transistor circuits is to stack the chips vertically, that is, in 3D ICs.įor a successful merger, precise fabrication of the microstructure in the packaging technology is required. As Si chip technology approaches the limit of Moore’s law, the microelectronic industry is turning to packaging technology to extend the limit using three-dimensional integrated circuits (3D ICs), which, in essence, represents the merging of chip technology and packaging technology. With the popularity of hand-held devices, mobile consumer electronic products are expected to undergo a very rapid growth in the global semiconductor market in the near future.

Singlecrystal inverse pole figure software